Methods Of Forming NAND Cell Units And NAND Cell Units

ABSTRACT

Some embodiments include methods of forming charge storage transistor gates and standard FET gates in which common processing is utilized for fabrication of at least some portions of the different types of gates. FET and charge storage transistor gate stacks may be formed. The gate stacks may each include a gate material, an insulative material, and a sacrificial material. The sacrificial material is removed from the FET and charge storage transistor gate stacks. The insulative material of the FET gate stacks is etched through. A conductive material is formed over the FET gate stacks and over the charge storage transistor gate stacks. The conductive material physically contacts the gate material of the FET gate stacks, and is separated from the gate material of the charge storage transistor gate stacks by the insulative material remaining in the charge storage transistor gate stacks. Some embodiments include gate structures.

TECHNICAL FIELD

Semiconductor constructions, methods of forming transistor gates, andmethods of forming NAND cell units.

BACKGROUND

Memory devices provide data storage for electronic systems. One type ofmemory is a non-volatile memory known as flash memory. A flash memory isa type of EEPROM (electrically-erasable programmable read-only memory)that may be erased and reprogrammed in blocks. Many modern personalcomputers have BIOS stored on a flash memory chip. Such BIOS issometimes called flash BIOS.

Flash memory is also popular in wireless electronic devices because itenables manufacturers to support new communication protocols as theybecome standardized, and to provide the ability to remotely upgrade thedevices for enhanced features.

A typical flash memory comprises a memory array that includes a largenumber of memory cells arranged in row and column fashion. The cells areusually grouped into blocks. Each of the cells within a block may beelectrically programmed by charging a floating gate. The charge may beremoved from the floating gate by a block erase operation. Data isstored in a cell as charge in the floating gate.

NAND is a basic architecture of flash memory. A NAND cell unit comprisesat least one select gate coupled in series to a serial combination ofmemory cells (with the serial combination being commonly referred to asa NAND string).

Flash memory, or more generally EEPROM, incorporate charge storagestructures into transistor gates, and incorporate control gatestructures over the charge storage structures. The charge storagestructures may be immediately over gate dielectric. The charge storagestructures may, for instance, comprise floating gate material orcharge-trapping material. The amount of charge stored in the chargestorage structures determines a programming state. In contrast, standardfield effect transistors (FETs) do not utilize charge storage structuresas part of the transistors, but instead have a conductive gate directlyover gate dielectric material. EEPROM, such as flash, may be referred toas charge storage transistors to indicate that charge storage structuresare incorporated into the transistors. The gates of the charge storagetransistors may be referred to as charge storage transistor gates.

It is desired to form the select gates to be standard field effecttransistors (FETs), rather than charge storage transistors, and to formthe string gates as charge storage transistors. Yet, it is also desiredto utilize common processing steps for fabrication of the select gatesand string gates. This is creating difficulties with conventionalprocessing, and accordingly it is desired to develop new processing forfabrication of the select gates and string gates. Also, numerousperipheral gates may be formed adjacent a NAND memory array and utilizedfor controlling reading and writing relative to the memory array. Itwould be desired to develop processing which utilized common processsteps for fabrication of the peripheral gates, string gates and selectgates.

Although charge storage transistors (i.e., EEPROM transistors) of NANDhave traditionally utilized floating gate material (for instance,polycrystalline silicon) for retaining charge, there has beensubstantial interest in replacing the floating gate material with chargetrapping material (for instance, silicon nitride and/or conductivenanodots). It would be desirable for the processing utilized forfabrication of string gates, select gates, and peripheral gates to begenerally applicable for applications in which the string gatescorrespond to charge storage transistor gates utilizing floating gatematerial, as well as to applications in which the string gatescorrespond to charge storage transistor gates utilizing charge-trappingmaterial.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified block diagram of a memory system in accordancewith an embodiment.

FIG. 2 is a schematic of a NAND memory array in accordance with anembodiment.

FIGS. 3-11 are diagrammatic, cross-sectional views of various portionsof a semiconductor construction shown at various process stages of anembodiment.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

FIG. 1 is a simplified block diagram of a memory system 100, accordingto an embodiment. Memory system 100 includes an integrated circuit flashmemory device 102 (e.g., a NAND memory device), that includes an arrayof floating-gate memory cells 104, an address decoder 106, row accesscircuitry 108, column access circuitry 110, control circuitry 112,input/output (I/O) circuitry 114, and an address buffer 116. Memorysystem 100 includes an external microprocessor 120 electricallyconnected to memory device 102 for memory accessing as part of anelectronic system. The memory device 102 receives control signals fromthe processor 120 over a control link 122. The memory cells are used tostore data that is accessed via a data (DQ) link 124. Address signalsare received via an address link 126, and are decoded at address decoder106 to access the memory array 104. Address buffer circuit 116 latchesthe address signals. The memory cells may be accessed in response to thecontrol signals and the address signals.

FIG. 2 is a schematic of a NAND memory array 200. Such may be a portionof memory array 104 of FIG. 1. Memory array 200 includes access lines(i.e., wordlines) 2021 to 202 _(N), and intersecting local data lines(i.e., bitlines) 2041 to 204 _(M). The number of wordlines 202 and thenumber of bitlines 204 may be each some power of two, for example, 64wordlines and 64 bitlines. The local bitlines 204 may be coupled toglobal bitlines (not shown) in a many-to-one relationship.

Memory array 200 includes NAND strings 206 ₁ to 206 _(M). Each NANDstring includes floating gate transistors 208 ₁ to 208 _(N). Thefloating gate transistors are located at intersections of wordlines 202and a local bitlines 204. The floating gate transistors 208 representnon-volatile memory cells for storage of data, or in other words arecomprised by flash transistor gates. The floating gate transistors 208of each NAND string 206 are connected in series source to drain betweena source select gate 210 and a drain select gate 212. Each source selectgate 210 is located at an intersection of a local bitline 204 and asource select line 214, while each drain select gate 212 is located atan intersection of a local bitline 204 and a drain select line 215.

A source of each source select gate 210 is connected to a common sourceline 216. The drain of each source select gate 210 is connected to thesource of the first floating-gate transistor 208 of the correspondingNAND string 206. For example, the drain of source select gate 210 ₁ isconnected to the source of floating-gate transistor 208 ₁ of thecorresponding NAND string 206 ₁.

The drain of each drain select gate 212 is connected to a local bitline204 for the corresponding NAND string at a drain contact 228. Forexample, the drain of drain select gate 212 ₁ is connected to the localbitline 2041 for the corresponding NAND string 206 ₁ at drain contact2281. The source of each drain select gate 212 is connected to the drainof the last floating-gate transistor 208 of the corresponding NANDstring 206. For example, the source of drain select gate 212 ₁ isconnected to the drain of floating gate transistor 208 _(N) of thecorresponding NAND string 206 ₁.

Floating gate transistors 208 (i.e., flash transistors 208) include asource 230 and a drain 232, a floating gate 234, and a control gate 236.Floating gate transistors 208 have their control gates 236 coupled to awordline 202. A column of the floating gate transistors 208 are thoseNAND strings 206 coupled to a given local bitline 204. A row of thefloating gate transistors 208 are those transistors commonly coupled toa given wordline 202.

Some embodiments include methods in which common steps are utilizedduring fabrication of gates of both charge storage transistors andstandard FETs for integrated circuitry. Throughout this document, adistinction is made between FET gates and charge storage transistorgates. FET gates are gates in which there is not charge-trapping orelectrically floating material between a controlled transistor gate anda channel region, and charge storage transistor gates are gates in whichthere is charge-trapping or electrically floating material between acontrolled transistor gate and a channel. The distinction between FETgates and charge storage transistor gates is based on structuralcharacteristics of the gates rather than operational characteristics. Itis recognized that charge storage transistor gates (for instance, flashgates) may be operated identically to FET gates if the floating materialof the charge storage transistor gates is appropriately charged, andthat charge storage transistor gates are utilized as FET devices in someconventional applications. However, the charge storage transistordevices remain structurally distinguishable from standard FET devices,regardless of the operational similarity of some charge states of chargestorage transistor devices to standard FET devices.

An example embodiment is described with reference to FIGS. 3-11.

Referring initially to FIG. 3, several portions 12, 14, 16, 18 and 20 ofa semiconductor construction 10 are illustrated. The portion 16corresponds to a region where charge storage transistor gates (forinstance, flash gates) are to be formed, and may, for example,correspond to the string gate region of a NAND cell unit (for instance,a region where one or more of the string gates of NAND string 206 ₁ ofFIG. 2 are to be formed). The portions 14 and 18 may correspond toregions where select gates are to be formed (for instance, the regionswhere select gates 210 ₁ and 212 ₁ of FIG. 2 are to be formed). Theportions 12 and 20 may correspond to regions where peripheral circuitry(specifically, circuitry peripheral to a NAND memory array) is to beformed.

Semiconductor construction 10 comprises a substrate (i.e., base) 22.Substrate 22 may comprise, consist essentially of, or consist of, forexample, monocrystalline silicon lightly-doped with background p-typedopant. The terms “semiconductive substrate” and “semiconductorsubstrate” mean any construction comprising semiconductive material,including, but not limited to, bulk semiconductive materials such as asemiconductive wafer (either alone or in assemblies comprising othermaterials thereon), and a semiconductive material layer (either alone orin assemblies comprising other materials). The term “substrate” refersto any supporting structure, including, but not limited to, thesemiconductive substrates described above. Although substrate 22 isshown to be homogeneous, in some embodiments the substrate may compriseone or more layers or components associated with integrated circuitrythat has been formed across a semiconductor base.

A stack 24 of various materials is formed over semiconductor substrate22. The stack comprises, in ascending order from substrate 22, a gatedielectric material 26; a gate material 28; a plurality of dielectricmaterials 30, 32 and 34; a sacrificial material 36; and a protectivematerial 38.

The gate dielectric material 26 may comprise any suitable composition orcombination of compositions; and may, for example, comprise, consistessentially of, or consist of silicon dioxide. The gate dielectricmaterial may be the same across all of the portions 12, 14, 16, 18 and20, or may differ in one portion relative to another portion.

The gate material 28 may comprise any suitable composition orcombination of compositions; and may, for example, comprise, consistessentially of, or consist of conductively-doped semiconductor material(for instance, conductively-doped silicon).

In some embodiments, the gate material may consist of conductively-dopedsilicon, and may have the same type of conductivity doping across all ofthe portions (or regions) 12, 14, 16, 18 and 20. Accordingly, theentirety of the gate material may be either n-type doped silicon orp-type doped silicon.

In other embodiments, the gate material may consist ofconductively-doped silicon, and may have a different type ofconductivity-enhancing dopant in one or more of the portions 12, 14, 16,18 and 20 relative to another of the portions 12, 14, 16, 18 and 20. Forinstance, the gate material may consist of p-type doped silicon in theportion 16 where charge storage transistor gates (for instance, flashmemory gates) are ultimately to be formed, and may consist of n-typedoped silicon in one or more of the portions 12, 14, 18 and 20 wherestandard FET gates are to be formed.

In yet other embodiments, the gate material may comprise, consistessentially of, or consist of one or more charge-trapping compositionsin the portion 16 where charge storage transistor gates are ultimatelyto be formed, and may consist of conductively-doped semiconductormaterial in the portions 12, 14, 18 and 20 where standard FET gates areultimately to be formed.

If the gate material 28 is the same across an entirety of substrate 22,it may be referred to as a material blanket deposited across substrate22. If the gate material comprises a different composition in one of theshown portions 12, 14, 16, 18 and 20 relative to another of the shownportions; the gate material in the one of the shown portions may bereferred to as first gate material, and the gate material in the otherof the shown portions may be referred to as second gate material. Forinstance, the gate material 28 of portion 16 may be a first gatematerial, while the gate material 28 of portions 12, 14, 18 and 20 maybe a second gate material that is different in composition from thefirst gate material.

The electrically insulative materials 30, 32 and 34 may comprise anysuitable composition or combination of compositions. In someembodiments, the materials 30, 32 and 34 may comprise, consistessentially of, or consist of one or more of silicon dioxide, hafniumoxide, aluminum oxide, zirconium oxide, hafnium aluminum oxide, hafniumsilicon oxide, etc. Although three electrically insulative materials areshown formed directly over the gate material 28, in other embodimentsthere may be a different number of discrete electrically insulativematerials formed directly over the gate material. Generally, there willbe at least one electrically insulative material formed over the gatematerial. The electrically insulative materials that are directly overgate material 28 may be the same across all of the portions 12, 14, 16,18 and 20, or may differ in one portion relative to another portion.

The sacrificial material 36 may comprise any suitable composition orcombination of compositions, and may, for example, comprise, consistessentially of, or consist of silicon. In some embodiments, sacrificialmaterial 36 may consist of one or both of amorphous and polycrystallinesilicon; and may or may not be conductively-doped. In some embodiments,the gate material 28 and the sacrificial material 36 both comprisesilicon. In such embodiments, the gate material may be referred to as afirst silicon-containing material, and the sacrificial material may bereferred to as a second silicon-containing material.

Protective material 38 may comprise any suitable composition orcombination of compositions; and in some embodiments may comprise,consist essentially of, or consist of silicon dioxide. Protectivematerial 38 may be formed by chemical vapor deposition utilizingtetraethylorthosilicate.

The stack 24 may be formed by any suitable method, including, forexample, one or more of atomic layer deposition (ALD), chemical vapordeposition (CVD), and physical vapor deposition (PVD). Although all ofthe materials of the stack are shown comprising a uniform thicknessacross all of the portions 12, 14, 16, 18 and 20, the invention alsoincludes embodiments in which one or more of the materials has adifferent thickness across some of the portions than across others ofthe portions. The embodiments in which one or more of the materials hasa different thickness across some of the portions than across others ofthe portions may also be embodiments in which one or more of thematerials comprises a different composition across some of the portionsthan across others of the portions.

Referring to FIG. 4, stack 24 is patterned into a plurality of pillars40, 42, 44, 46, 48, 50, 52 and 54. The pillars are spaced apart from oneanother, and gaps extend between the pillars. For instance, gaps 56, 58and 60 are shown between adjacent pillars 44, 46, 48 and 50. Thepatterning of the gate stack into the pillars may be accomplished by anysuitable processing. In an example embodiment, a photolithographicallypatterned mask (for instance, a photoresist mask) may be provided overthe stack 24 to define locations of the pillars, the stack may then beetched to form the pillars, and subsequently the mask may be removed toleave the shown construction.

The pillars may be referred to as gate stacks, in that the pillars areultimately utilized to form gates. Some of the pillars are ultimatelyutilized to form gates of charge storage transistors, while others areutilized to form gates of standard FETs. For instance, the pillars 44,46, 48 and 50 across portion 16 may be utilized to form charge storagetransistor gates, while the pillars 40, 42, 52 and 54 may be utilized toform standard FET gates. In such embodiments, the pillars 44, 46, 48 and50 may be considered to be charge storage transistor gate stacks (forinstance, flash gate stacks) at charge storage transistor gate locations(for instance, flash gate locations), while the pillars 40, 42, 52 and54 may be considered to be standard FET gate stacks at gate locations ofthe standard FETs.

In some embodiments, the pillars 44, 46, 48 and 50 are utilized to formstring gates of a NAND cell unit (for instance, the string gates of NANDstring 206 ₁ of FIG. 2), and the pillars 42 and 52 are utilized to formselect gates of the NAND cell unit (for instance, the select gates 210 ₁and 212 ₁ of FIG. 2). In such embodiments, the pillars 44, 46, 48 and 50may be referred to as string gate stacks, while the pillars 42 and 52are referred to as select gate stacks. Although four string gate stacksare shown, in other embodiments there may be other numbers of stringgate stacks. In some embodiments, there will be at least two string gatestacks. Also, although two select gate stacks are shown, in otherembodiments there may be other numbers of select gate stacks; and may bereferred to as being at least one select gate stack.

The pillars 40, 42, 44, 46, 48, 50, 52 and 54 may be formed to have acommon width as one another in some embodiments, and in otherembodiments at least one of the pillars may have a different width thananother pillar. For instance, the charge storage transistor gate stacksmay be formed to have different widths than the standard FET gatestacks.

The pillars (i.e., gate stacks) 40, 42, 44, 46, 48, 50, 52 and 54comprise sidewalls 41, 43, 45, 47, 49, 51, 53 and 55, respectively. Thesidewalls define opposing sides of the pillars.

Referring to FIG. 5, spacers 62 are formed along the sidewalls 41, 43,45, 47, 49, 51, 53 and 55. Spacers 62 may comprise electricallyinsulative material; and may, for example, comprise, consist essentiallyof, or consist of one or more of silicon dioxide, silicon nitride andsilicon oxynitride. Spacers 62 may be formed by depositing a layer ofspacer material across substrate 22, and conformally along sidewalls andtops of pillars 40, 42, 44, 46, 48, 50, 52 and 54; followed by ananisotropic etch of the spacer material to leave the shown spacers.

Referring to FIG. 6, electrically insulative material 64 is formed overpillars 40, 42, 44, 46, 48, 50, 52 and 54; and within the gaps (forinstance, gaps 56, 58 and 60) between the pillars. Electricallyinsulative material 64 may comprise any suitable composition orcombination of compositions; and may, for example, comprise, consistessentially of, or consist of one or more of silicon dioxide,borophosphosilicate glass (BPSG) and silicon nitride.

Referring to FIG. 7, construction 10 is subjected to planarization (forinstance, chemical-mechanical polishing) to form a planarized uppersurface 65 extending across material 64, spacers 62, and the sacrificialmaterial 36 of pillars 40, 42, 46, 48, 50, 52 and 54. The planarizationhas removed upper portions of spacers 62, and has entirely removed theprotective material 38 (FIG. 6).

Referring to FIG. 8, sacrificial material 36 (FIG. 7) is removed fromall of the pillars 40, 42, 44, 46, 48, 50, 52 and 54 to form cavities(i.e., openings) 80, 82, 84, 86, 88, 90, 92 and 94 at the tops of thepillars. Each of the cavities is bounded by the electrically insulativematerial 34 along the bottom, and by the spacers 62 along the sides.

The removal of sacrificial material 36 (FIG. 7) may be accomplishedutilizing an etch selective for the sacrificial material relative tospacers 62, insulative material 64 and material 34. For instance, ifspacers 62, material 64 and material 34 comprise one or more of silicondioxide, silicon nitride and silicon oxynitride, then sacrificialmaterial 36 may comprise polycrystalline silicon (either doped orundoped), so that the sacrificial material may be selectively removedrelative to spacers 62, material 64 and material 34. In embodiments inwhich the materials 28 and 36 are first and second silicon-containingmaterials, respectively, the removal of sacrificial material 36 may bereferred to as removal of the second silicon-containing material.

The depths of cavities 80, 82, 84, 86, 88, 90, 92 and 94 may be tailoredby controlling a thickness of the sacrificial material 36 (FIG. 7) thatis ultimately removed to form the cavities. In some embodiments, thecavities will have a depth of at least about 50 angstroms.

Referring to FIG. 9, a masking material 96 is formed over construction10. The masking material 96 is patterned so that it has openingsextending therethrough within the cavities 80, 82, 92 and 94 associatedwith the standard FET gate stacks (specifically, associated with thepillars 40, 42, 52 and 54) while not having openings extendingtherethrough to the cavities associated with the charge storagetransistor gate stacks (specifically, associated with the pillars 44,46, 48 and 50). The openings extending through masking material 96 arelabeled as 100, 102, 104 and 106 in FIG. 9.

Masking material 96 may comprise, for example,photolithographically-patterned photoresist. Alternatively, oradditionally, masking material 96 may comprise a hard mask patternedutilizing photolithographically-patterned photoresist and one or moreetches.

After formation and patterning of masking material 96, etching isutilized to extend the openings 100, 102, 104 and 106 through materials30, 32 and 34 to expose the gate material 28 of the standard FET gatestacks (specifically, to expose the gate material 28 of the pillars 40,42, 52 and 54).

In the shown embodiment, the openings 100, 102, 104 and 106 are narrowerthan the cavities 80, 82, 92 and 94, and accordingly only some regionsof materials 30, 32 and 34 are removed from over pillars 40, 42, 52 and54. In other embodiments (not shown) the openings 100, 102, 104 and 106may be at least as wide as the cavities 80, 82, 92 and 94 so that all ofthe materials 30, 32 and 34 are removed from over pillars 40, 42, 52 and54.

Referring to FIG. 10, masking material 96 (FIG. 9) is removed. Theremaining cavities 80, 82, 92 and 94 of the standard FET gate stacks(specifically, the cavities associated with pillars 40, 42, 52 and 54)are bounded by spacers 62, by materials 30, 32 and 34, and by gatematerial 28.

In the shown embodiment, the cavities 80, 82, 92 and 94 of FIG. 10extend along and through remaining portions of materials 30, 32 and 34.In contrast, the cavities 84, 86, 88 and 90 of the charge storagetransistor gate stacks (specifically, the cavities associated withpillars 44, 46, 48 and 50) do not extend through materials 30, 32 and34. Thus, the electrically insulative materials 30, 32 and 34 of thestandard FET gate stacks extend only partially across the gate material28 of the standard FET gate stacks at the processing stage of FIG. 10,while the electrically insulative materials 30, 32 and 34 of the chargestorage transistor gate stacks extend entirely across the gate materialof the charge storage transistor gate stacks.

FIG. 10 shows a first conductive material 110 formed conformally withincavities 80, 82, 84, 86, 88, 90, 92 and 94 to partially fill thecavities and thereby narrow the cavities. The electrically conductivematerial 110 physically contacts the gate material 28 within cavities80, 82, 92 and 94 of the standard FET gate stacks; and is spaced fromthe gate material 28 of the charge storage transistor gate stacks(specifically, the material 28 of the pillars 44, 46, 48 and 50) by theelectrically insulative materials 30, 32 and 34. If material 28 isp-type doped polysilicon, the material 110 may be a metal with a highwork function (with a “high work function” being at least about 4.6electronvolts). For instance, material 110 may be titanium nitrideand/or tantalum nitride deposited by one or both of ALD and CVD.Material 110 may have a thickness of from about 10Δ to about 150 Å; suchas, for example, a thickness of from about 15 Å to about 50 Å. It may bepreferred for the material 28 to be p-type doped in the charge storagetransistors in embodiments in which the material 28 isconductively-doped semiconductor material. In contrast, either of n-typedoped material or p-type doped material may be equally suitable for thematerial 28 of the standard FET transistors in embodiments in which thematerial 28 is conductively-doped semiconductor material.

A second electrically conductive material 112 is over the firstelectrically conductive material 110. The second electrically conductivematerial extends into the cavities narrowed by conductive material 110and completely fills such narrowed cavities.

In some embodiments, the first and second conductive materials 110 and112 comprise one or more metals. The first conductive material 110 may,for example, comprise a metal-containing composition; and in someembodiments may comprise, consist essentially of, or consist of metalnitride. For instance, first conductive material 110 may comprise,consist essentially of, or consist of one or both of tungsten nitrideand tantalum nitride. The second conductive material 112 may comprise,consist essentially of, or consist of one or more metals and/or one ormore metal-containing compositions. In an example embodiment, secondelectrically conductive material 112 may comprise, consist essentiallyof, or consist of tungsten.

Referring to FIG. 11, construction 10 is subjected to planarization (forinstance, chemical-mechanical polishing) to form a planarized surface115 extending across spacers 62, and materials 64, 110 and 112. Thepillars 40, 42, 52 and 54 of FIG. 11 correspond to standard FET gates,and specifically have the upper conductive materials 110 and 112 shortedto the gate material 28. The pillars 44, 46, 48 and 50 correspond tocharge storage transistor gates, and have the upper conductive materials110 and 112 separated from gate material 28 by the electricallyinsulative materials 30, 32 and 34.

Source/drain regions 120, 122, 124, 126, 128, 130, 132, 134, 136, 138,140, 142 and 144 are formed proximate the standard FET gates and thecharge storage transistor gates to incorporate the gates into transistorconstructions, as is diagrammatically illustrated in FIG. 11. Thesource/drain regions may be formed by implanting appropriateconductivity-enhancing dopant into semiconductor substrate 22. Thesource/drain regions may be formed at any suitable processing stage, andin some embodiments may be implanted at the processing stage of FIG. 5so that the source/drain regions are self-aligned with the gates.

The cross-section of FIG. 11 may correspond to a plane through a NANDmemory array (for instance, the array discussed above with reference toFIG. 2) and accordingly the shown standard FET gates and charge storagetransistor gates may be along lines that extend into and out of the pagerelative to FIG. 11. The conductive materials 110 and 112 may formelectrically conductive fins extending along such lines, and accordinglystructures formed in accordance with some embodiments may be consideredto be fin-type structures.

In compliance with the statute, the subject matter disclosed herein hasbeen described in language more or less specific as to structural andmethodical features. It is to be understood, however, that the claimsare not limited to the specific features shown and described, since themeans herein disclosed comprise example embodiments. The claims are thusto be afforded full scope as literally worded, and to be appropriatelyinterpreted in accordance with the doctrine of equivalents.

1-31. (canceled)
 32. A method of forming a NAND cell unit, comprising:forming at least one select gate spaced from at least two string gates,the at least one select gate comprising a first gate material, a firstelectrically insulative material adjacent the first gate material, and asacrificial material adjacent the first electrically insulativematerial; the string gates comprising a second gate material, a secondelectrically insulative material adjacent the second gate material, andthe sacrificial material adjacent the second electrically insulativematerial; removing the sacrificial material from the at least one selectgate and from the string gates; etching through the first electricallyinsulative material to the first gate material; and after etchingthrough the first electrically insulative material, forming a conductivematerial adjacent the at least one select gate and adjacent the stringgates, the conductive material physically contacting the first gatematerial and being separated from the second gate material by the secondelectrically insulative material.
 33. The method of claim 32 wherein thefirst and second gate materials consist of conductively-doped silicon,and wherein the conductive material comprises at least one metal. 34.The method of claim 32 wherein the first and second gate materialsconsist of conductively-doped silicon, wherein the second gate materialconsists of p-type doped silicon, wherein the conductive materialcomprises one or both of titanium nitride and tantalum nitride.
 35. Themethod of claim 34 wherein the conductive material has a thickness offrom about 10 Å to about 150 Å.
 36. The method of claim 34 wherein theconductive material has a thickness of from about 15 Å to about 50 Å.37. The method of claim 32 wherein: the first gate material consists ofconductively-doped silicon; the second gate material comprises at leastone charge-trapping composition; and the conductive material comprisesat least one metal.
 38. The method of claim 32 wherein the first andsecond gate materials are compositionally different from one another.39. The method of claim 32 wherein the first and second electricallyinsulative materials are compositionally the same as one another. 40.The method of claim 32 wherein the forming the at least one select gatecomprises forming a plurality of discrete layers of insulative materialadjacent the first gate material.
 41. A NAND cell unit comprising: aselect gate comprising: gate material; electrically insulative materialonly partially covering the gate material leaving an opening; a firstconductive material in the opening; and a second conductive material inthe opening; and a string gate spaced from the select gate.
 42. The NANDcell unit of claim 41 wherein the first conductive material contacts thegate material.
 43. The NAND cell unit of claim 41 wherein the first andsecond conductive material fill the opening in the electricallyinsulative material.
 44. The NAND cell unit of claim 41 wherein thestring gate further comprises the electrically insulative material. 45.The NAND cell unit of claim 44 wherein the electrically insulativematerial of the string gate has no opening.
 46. The NAND cell unit ofclaim 44 wherein the electrically insulative material comprises aplurality of discrete layers.
 47. The NAND cell unit of claim 41 whereinthe electrically insulative material comprises a plurality of discretelayers.
 48. The NAND cell unit of claim 41 wherein the string gatecomprises gate material different from the gate material of the selectgate.
 49. The NAND cell unit of claim 48 wherein the gate material forthe string gate comprises one or more charge-trapping compositions. 50.The method of claim 41 wherein the gate material comprisesconductively-doped silicon.
 51. The method of claim 41 wherein the gatematerial comprises conductively-doped silicon, and wherein the firstconductive material comprises at least one metal.